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DiaPlus™ is a 5th generation bonding agent with high bonding strength
Power Supply (Adapter)
4007-2285 AC Power Cord
Designed to be used with Duo-Gun or other obturation guns
06 #20 242-608 DIA-SYSTEM GTP
Dia-X Bond Universal (Universal Bonding Agent) plugger DiaPlus™ is a 5th generationDia X Bond Universal is a single component universal bonding agent providing adhesion to various surfaces and substrates for direct and indirect restorations. It can be used with all etching techniques including self etch, selective etch, and total etch. Indications for Use: All direct restorations: Resin based composite, resin modified glass ionomers, core build up, resin cement, etc. All indirect restorations: metal, zirconia, glass ceramics,
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